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Technical Ability

 

Items

Parameters

Remarks

Double side/Multi-layer

Max panel size

32”×20”(800 mm×508 mm)

 

Minimum track / gap IL

0.075 mm/0.075 mm(3mil/3mil)

 

Min annular ring on inner layer one side

3mil(0.075 mm)

 

Minimum dielectric thickness

4mil(0.1 mm)

 

Maximum Cu weight OL

6oz(210um)

 

Maximum Cu weight IL

12oz(420um)

 

Finished board thickness

0.20-6 mm

 

Tolerance of total thickness

Thickness 1.0 mm

±12%

4-8layers

1.0≤Thickness2.0 mm

±8%

4-8layers

±10%

≥10layers

Thickness≥2.0 mm

±10%

Inner layer Surface treating process

Brown Oxidation

Layer count

2-32L

Layer to layer registration

±3mil(±76um)

Min finished hole diameter

0.15 mm(6mil), 0.1 mm(4mil) for HDI

Hole position Accuracy

±2mil(±50um)

Slot hole Tolerance

±3mil(±75um)

PTH diameter tolerance

±2mil(±50um)

N PTH diameter tolerance

±1mil(±25um)

Max Aspect ratio PTH

10:1

Copper on the wall of the holes

0.4-2mil(10-50um)

Graphic pattern registration tolerance

±3mil(0.075um)

Minimum track / gap IL (mil)- copper weight dependent

3mil/3mil(75um/75um)

 Solder mask thickness

 

Solder mask Hardness

6H

Solder mask registration tolerance

±2mil(±50um)

Min solder mask dam

3.0mil(75um)

Max solder mask plug hole diameter

0.6 mm

Surface treatment

HASL(with lead), HASL(Lead free), Au and Nickle Gold plating, OSP, ENIG, EESPIG, Immersion silver, Immersion Tin

ENIG    Nikle thickness range

120u”/240u”(3um/6um)

ENIG    Au thickness range

2u”/6u”(0.05um/0.15um)

Impedance control and tolerance

±10% Differential impedance 

Conductor peel strength 

≥61B/in(≥107g/mm)

Bow and twist 

≤0.75%

HDI / Buried - blind via

Applicable

Substrate material 

Fr4 standard, halogen free, high performance,CEM-1,CEM-3, Polyimild, PTFE, IMS, Rogers

PCB base material supplier

ShengYi, ITEQ, NanYa, KB, ISOLA, Rogers etc.

 Solder mask thickness

conductor surface

0.4-1.2mil(10-30um)

conductor Side

≥0.2mil(5um)

On Substrate

≤ finished Cu thickness+1.2mil(≤ finished Cu thickness+30um) 

 

    
LHD Technology Co., Ltd. 

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   Factory Add:No.26, Meiyuan 3rd Road, Intercontinental Industrial Park, Luoyang Town, Boluo County, Huizhou, Guangdong, China.
   Office Add:Room 301, Hua Sui Mansion 47th Build Xicheng Industry District,  Xixiang Street, Baoan District, Shenzhen City, Guangdong, China.
    Phone :+86-13715307049
    E-mail : info@lhd-pcb.com
  Fax : 0755-86966026
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