PCB Assembly Service

PCB Assembly Advanced Capabilities

  • PCB Assembly types include SMT(Surface Mount Technology), THD (Thru-Hole Device), SMT&THD mixed,2 sided SMT and THD assembly. LHD Technology support Fine Pitch components as small as 8 mil pitch,Passives parts smallest size 0201, BGA(Ball Grid Arrays) as small as 0.4mm pitch with X-Ray inspected placements, and more.
SMT Lines 9 Lines
Capacity 52 million placements per month
Max Board Size 680X500mm Smallest:0.25"x0.25"
Min Component size 0201–54sq.mm.(0.084sq.inch), longconnector,CSP,BGA,QFP
Speed 0.15sec/chip, 0.7sec/QFP
Wave-Solder Max.PCB width:450mm
Min.PCB width:nolimited
Component height:Top 120mm / Bot 15mm
Sweat-Solder Metal type:part,whole,inlay,sidestep
Metal material:Copper,Aluminum
Surface Finish:platingAu,platingsliver,platingSn
Air bladder rate:less than20%
Press-fit Press range:0-50KN
Max.PCB size:800X600mm
Quantity No MOQ, Prototype & Low Volume PCB Assembly, And mass assembly
Type of Assembly SMT and Thru-hole
Solder Type Water Soluble Solder Paste, Leaded and Lead-Free
Components Passives Down to 0201 Size BGA and VFBGA Leadless Chip Carrier/CSP  Double-Sided SMT Assembly Fine Pitch to 08 Mil BGA Repair and Reball Part  Removal and Replacement-Same Day Service
File Formats Bill of Materials, Gerber Files,Pick-N-Place File(XYRS)
Type of Service Turn-Key,Partial Turn-Key or Consignment
Component Cut Tape, TubeReels Loose,Parts
Turn Time Same Day Service to 15 day service
Testing XRAY Inspection,AOI Testing,ICT,Probeflying,burn-in,functiontest,temperature cycling.

One Stop Solution-From Design to Assembly

  • LHD Technology is a PCB Assembly Manufacturer with rich experience in PCB Assembly and technologies related to PCBA.Our professional capacity enable us a customer-specific production from prototypes to mass production.

Why choose PCB Assembly /EMS Service from LHD Technology

  • LHD PCB Assembly Service including not limited as below:
  • One Stop Solution
  • All types of assembly technologies are offered
  • Component Sourcing
  • Manual assembly and wave soldering are offered
  • Able to mount parts of all standard sizes (BGA, uBGA, Flip Chips, CSP, Connectors )
  • Defective fraction is lower than 0.15 %
  • Low to Medium volume production
  • Cable & Harnesses Assembly
  • Special mounting solutions include: coating,programming, draining,varnish cover, marking
  • Electro Mechanical/Box Build Assembly
  • Rapid Prototype
  • Electrical & Electronic Maintenance & Repair
  • Board layout from a customer supplied schematic diagram
  • Various testing method will be applied to the assembled boards before the final shipment(Visual inspection,X-ray Inspection,AOI Testing,ICT,Functional test)