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News

  • 2019-09-17

    Blind and Buried Vias

    This article clears up confusion about different via structures in PCB fabrication and lists the pros and cons of each.

  • 2019-09-17

    IPC4761-Type VII Via-in-paid&resin fill and copper cap

    IPC4761-Type VII mean that the via need resin filled and copper cap, as the picture shown.A lower cost alternative to the blind via is a process that fills the thru-hole via sand via in the BGA pads with a resin that replicates the coefficient of thermal expansion of the epoxy used in the prep reg.

  • 2019-09-17

    Basic Process Description for MLB and DSB

    Multi-layer vs. Double-sided PCBsMulti-layer PCB (MLB) processThe simplest MLB starts with a double-sided core. This thin, inner-layer material has copper on both sides. The copper surface is prepped with a photosensitive material that can be exposed by the application of UV light, and the light is

  • 2019-09-11

    How can We Find a Good PCB Manufacturer in China

    When speak of the topic, most people think that it will be so easy but actually not. By inputting produce name searching by google, tons of Chinese suppliers/manufacturers will catch yours eyes. However, you still think it is so difficult to find a capable and reliable one. Below are some practical

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