This article clears up confusion about different via structures in PCB fabrication and lists the pros and cons of each.
IPC4761-Type VII mean that the via need resin filled and copper cap, as the picture shown.A lower cost alternative to the blind via is a process that fills the thru-hole via sand via in the BGA pads with a resin that replicates the coefficient of thermal expansion of the epoxy used in the prep reg.
Multi-layer vs. Double-sided PCBsMulti-layer PCB (MLB) processThe simplest MLB starts with a double-sided core. This thin, inner-layer material has copper on both sides. The copper surface is prepped with a photosensitive material that can be exposed by the application of UV light, and the light is
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