This article clears up confusion about different via structures in PCB fabrication and lists the pros and cons of each.
IPC4761-Type VII mean that the via need resin filled and copper cap, as the picture shown.A lower cost alternative to the blind via is a process that fills the thru-hole via sand via in the BGA pads with a resin that replicates the coefficient of thermal expansion of the epoxy used in the prep reg.
Glad to meet you on the IPCA Expo 2019.
Welcome to visit our booth in the pcb&pcba show
Time: Sep. 25th-27th, 2019
Booth No.: EQ01-10
An X-out is when one of the individual boards on the array does not pass the test and is marked out with a marker. Some customers will allow a certain percentage of X outs on the order, while others may require there be No X-outs on any of the arrays. By having No X-outs.