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News Articles About PCB

  • 2019-09-17

    Blind and Buried Vias

    This article clears up confusion about different via structures in PCB fabrication and lists the pros and cons of each.

  • 2019-09-17

    IPC4761-Type VII Via-in-paid&resin fill and copper cap

    IPC4761-Type VII mean that the via need resin filled and copper cap, as the picture shown.A lower cost alternative to the blind via is a process that fills the thru-hole via sand via in the BGA pads with a resin that replicates the coefficient of thermal expansion of the epoxy used in the prep reg.

  • 2019-08-07

    Electronica India 2019

    Glad to meet you on the IPCA Expo 2019.
    Welcome to visit our booth in the pcb&pcba show
    Time: Sep. 25th-27th, 2019
    Booth No.: EQ01-10

  • 2019-07-30

    What' X-out PCB and LHD Tech's Standard

    An X-out is when one of the individual boards on the array does not pass the test and is marked out with a marker. Some customers will allow a certain percentage of X outs on the order, while others may require there be No X-outs on any of the arrays. By having No X-outs.

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