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Rigid-Flex PCB

Feature LHDPCB SPECIFICATION
Number of layers 2-18L
Technology highlights Mixed materials including RF and high speed, standard FR-4, polyimide Flex. Adhesive less or adhesive based polyimide flex Constructions, with cover coat or flexible solder mask materials
Bending performance Bend radius controls the flexibility of the flex portion of the board. The thinner the material the lower the bend radius and the More flexible the flex section.
Materials RA's copper, HTE copper, FR-4, polyimide, adhesive
Copper weights (finished) 18-70um
Minimum track and gap 0.075 mm / 0.075 mm
PCB thickness 0.3 mm to 5 mm
PCB thickness in flex section 0.05 mm to 0.8 mm
Maximum dimensions 450 mm to 600 mm
Surface finishes available ENIG, OSP Immersion tin, Immersion silver
Minimum mechanical drill 0.2 mm drilled (0.15 mm finished)

Rigid-flex PCB are boards using a lamination process to combination FPC and rigid PCB together. Most rigid-flex PCB use multilayers FPC substrates attached to one or more rigid boards depending upon the design. The FPC substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.

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