Rigid-Flex PCB
| Feature | LHDPCB SPECIFICATION |
| Number of layers | 2-18L |
| Technology highlights | Mixed materials including RF and high speed, standard FR-4, polyimide Flex. Adhesive less or adhesive based polyimide flex Constructions, with cover coat or flexible solder mask materials |
| Bending performance | Bend radius controls the flexibility of the flex portion of the board. The thinner the material the lower the bend radius and the More flexible the flex section. |
| Materials | RA's copper, HTE copper, FR-4, polyimide, adhesive |
| Copper weights (finished) | 18-70um |
| Minimum track and gap | 0.075 mm / 0.075 mm |
| PCB thickness | 0.3 mm to 5 mm |
| PCB thickness in flex section | 0.05 mm to 0.8 mm |
| Maximum dimensions | 450 mm to 600 mm |
| Surface finishes available | ENIG, OSP Immersion tin, Immersion silver |
| Minimum mechanical drill | 0.2 mm drilled (0.15 mm finished) |
Rigid-flex PCB are boards using a lamination process to combination FPC and rigid PCB together. Most rigid-flex PCB use multilayers FPC substrates attached to one or more rigid boards depending upon the design. The FPC substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.
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