Number of layers | 4 –14 layers standard, 18 layers advanced |
Technology highlights | Multi-layer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via Holes and capture pads allowing microchip to only penetrate select layers and also be placed in surface pads. |
HDI builds | 1+n+1, 2+N+2, 3+N+3 |
Materials | FR-4 high performance, Halogen-free FR-4, Rogers 4350B |
Copper weights (finished) | 18um – 70um |
PCB thickness | 0.40 mm – 3.20 mm |
Maximum dimensions | 600 mm x 450 mm; dependent upon laser drilling machine |
Surface finishes available | OSP, ENIG, EESPIG, HAL, LFH ASL Immersion Tin, Immersion Silver, Electroplate gold, Gold Fingers |
Minimum mechanical drill | 0.15 mm |
Minimum laser drill | 0.10 mm standard, 0.075 mm advanced |
size | 10-20 |
For product pricing, customization, or other inquiries:
For most of the projects, it’s necessary to make some prototypes to confirm and test the function before mass production, this is a very good way to demonstrate the success of the design, also it is economic.
We are very glad to help you make prototypes, we don’t have MOQ, any quantity are available for us. Welcome to make prototypes from us.
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