Number of layers | 4 –14 layers standard, 18 layers advanced |
Technology highlights | Multi-layer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via Holes and capture pads allowing microchip to only penetrate select layers and also be placed in surface pads. |
HDI builds | 1+n+1, 2+N+2, 3+N+3 |
Materials | FR-4 high performance, Halogen-free FR-4, Rogers 4350B |
Copper weights (finished) | 18um – 70um |
PCB thickness | 0.40 mm – 3.20 mm |
Maximum dimensions | 600 mm x 450 mm; dependent upon laser drilling machine |
Surface finishes available | OSP, ENIG, EESPIG, HAL, LFH ASL Immersion Tin, Immersion Silver, Electroplate gold, Gold Fingers |
Minimum mechanical drill | 0.15 mm |
Minimum laser drill | 0.10 mm standard, 0.075 mm advanced |
size | 10-20 |
For product pricing, customization, or other inquiries:
Tg is a mechanical property that designates glass transition temperature, that is, the highest temperature at which the substrate remains rigid.
the base material (polymer or glass) is shifting from a glassy, solid, rigid state to rubbery state when the temperature goes up to a certain area, so the temperature just at this moment is called the glass transition temperature (Tg)
Normal FR4 PCB tg is 130-140 degrees, the medium tg is greater than 150-160 degrees, high tg is greater than 170 degrees.
High tg 170 degrees have a better mechanical and chemical resistance to heat and moisture than standard FR4.
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