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High Density Interconnect PCB

Number of layers 4 –14 layers standard, 18 layers advanced
Technology highlights Multi-layer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via Holes and capture pads allowing microchip to only penetrate select layers and also be placed in surface pads.
HDI builds 1+n+1, 2+N+2, 3+N+3
Materials FR-4 high performance, Halogen-free FR-4, Rogers 4350B
Copper weights (finished) 18um – 70um
PCB thickness 0.40 mm – 3.20 mm
Maximum dimensions 600 mm x 450 mm; dependent upon laser drilling machine
Surface finishes available OSP, ENIG, EESPIG, HAL, LFH ASL Immersion Tin, Immersion Silver, Electroplate gold, Gold Fingers
Minimum mechanical drill 0.15 mm
Minimum laser drill 0.10 mm standard, 0.075 mm advanced

HDI PCB designs can include finer lines and spaces, smaller via sand capture pads, and higher pad density. High density PCB have blind via sand buried via sand typically contain microchip having a diameter of 0.006 or less.

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