| FEATURE | LHDPCB SPECIFICATION |
| Number of layers | 1 – 4 layers |
| Technology highlights | Effective heat sink solutions for thermal applications. This construction type enables superior heat dissipation through use
Of either aluminum or copper substrate bonded to the insulated circuitry through thermal pre-preg or resin systems. |
| Materials | Aluminum & copper plates. FR-4, PTFE, thermal dielectrics |
| Dielectric thickness | 0.05 mm – 0.20 mm |
| Thermal conductivity | 0.5-5 (W/(m·K) |
| Profile method | Punching, Liquid cooled routing |
| Copper weights (finished) | 18um – 210um |
| Minimum track and gaps | 0.10 mm / 0.10 mm |
| Metal core thickness | 0.40 mm - 3.20 mm |
| Maximum dimensions | 550 mm x 700 mm |
| Surface finishes available | HASL, LF HASL, OSP, ENIG, Immersion tin, Immersion silver |
| Minimum mechanical drill | 0.30 mm |
