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IMS – Insulated Metal Base PCB


Using an IMS board for a simple single layer circuit  is a special  but very effective method of dissipating components on a board. These are usually composed of aluminum, an insulating layer and a copper foil. Basic materials are available in different design versions.
bendable Aluminum base board

Better heat dissipation than FR4
Heat generated by components such as LEDs and transistors can be easily propagated and transmitted. The thermal conductivity of the insulating layer between the copper layer and the metal carrier is 5 to 10 times higher than that of the conventional FR4 material.

IMS Base PCB Applications 
Our factory dedicated to IMS products, supporting sectors including automotive, medical, aerospace, lighting applications and industrial controls. This is a segment that is growing rapidly and our spend is increasing month by month.

Please contact LHDPCB at any time if you need further information or assistance, we are happy to help you.
IMS PCB - Technical specification
FEATURE LHDPCB SPECIFICATION
Number of layers 1 – 4 layers
Technology highlights Effective heat sink solutions for thermal applications. This construction type enables superior heat dissipation through use
Of either aluminum or copper substrate bonded to the insulated circuitry through thermal pre-preg or resin systems.
Materials Aluminum & copper plates. FR-4, PTFE, thermal dielectrics
Dielectric thickness 0.05 mm – 0.20 mm
Thermal conductivity 0.5-5 (W/(m·K)
Profile method Punching, Liquid cooled routing
Copper weights (finished) 18um – 210um
Minimum track and gaps 0.10 mm / 0.10 mm
Metal core thickness 0.40 mm - 3.20 mm
Maximum dimensions 550 mm x 700 mm
Surface finishes available HASL, LF HASL, OSP, ENIG, Immersion tin, Immersion silver
Minimum mechanical drill 0.30 mm

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