SMT is a surface mounted technology, which is currently the most popular technology and process in the electronics assembly industry.
It is a kind of surface assembly components without leads or short leads (SMC/SMD for short, chip components in Chinese) mounted on the surface of a printed circuit board (PCB) or the surface of other substrates. Reflow soldering or dip soldering and other methods to solder and assemble circuit assembly technology.
Printing (red glue/solder paste) --> Inspection (optional AOI automatic or visual inspection) --> Mounting (first paste small devices and then paste large devices: divided into high-speed placement and integrated circuit placement) - >Inspection (optional AOI optical/visual inspection)-->Welding (using hot air reflow soldering for soldering)--> Inspection (can be divided into AOI optical inspection appearance and functional test inspection)--> Maintenance (tool: welding Table and hot-air desoldering station, etc.) --> board splitting (manual or splitting machine for cutting boards)
The process flow is simplified as: printing-------patch-------welding-------overhaul